[Mip4] SECON 2006 Call for Papers
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[Mip4] SECON 2006 Call for Papers
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CALL FOR PAPERS
IEEE SECON 2006
Third Annual IEEE Communications Society Conference on
Sensor, Mesh and Ad Hoc Communications and Networks
Reston, VA, USA
September 25-29, 2006
Paper submissions due (via EDAS):
April 1, 2006 (Abstract/title registration)
April 7, 2006 (Full paper)
http://www.ieee-secon.org/2006/index.html
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The third annual IEEE SECON conference will provide a unique forum to
exchange ideas, techniques, and applications, discuss best practices,
raise awareness, and share experiences among researchers,
practitioners, standard developers and policy makers in the field of
sensor, ad hoc, and mesh networks and systems. IEEE SECON grew out of
IEEE INFOCOM (http://www.ieee-infocom.org) in 2004, in order to create
an event that focused on the important and exciting topics of Sensor,
Mesh and Ad Hoc Communications and Networks.
The conference will be organized to provide for collegiality and
continuity in the discussions of the various topics among participants
from the industrial, governmental and academic sectors.
Original technical papers that address the communications, networking,
applications, systems and algorithmic aspects of mesh and sensor
networks, as well as those that describe practical deployment and
implementation experiences are solicited for presentation at the
conference and publication in the conference proceedings. Papers
presenting novel contributions in such disciplines as communications,
networking protocols and architectures, algorithms, embedded systems,
middleware and information management, and novel applications are
solicited.
PAPERS:
Full papers - describing original, previously unpublished research
work, experimental efforts, practical experiences, and industrial and
commercial developments in sensor, ad hoc, and mesh communications and
networks - are solicited. Papers with a deep focus on a specific
discipline or stimulated by the synergistic interaction of diverse
disciplines are encouraged. Papers describing practical application
of technology to real-world problems are similarly encouraged. Papers
submitted should not be concurrently under review at another
conference, journal or similar venue.
Particular topics of interest include, but are not limited to:
* New architectures and protocols to support communication,
localization, time synchronization, routing, data dissemination, and
other distributed services in heterogeneous, large-scale distributed,
mesh networks and sensor networks
* Novel algorithms and theories for management, supervisory control,
and monitoring of distributed ad hoc networks, and techniques for the
interpretation and use of sensor data in decision-making processes
* Modeling and performance evaluation of large-scale distributed ad
hoc and sensor networks, practical implementations and deployments,
and real-world experiences
* Theories and models on fundamental information and communication
aspects of wireless mesh and sensor networks
* Mechanisms for authenticated, secure communication and data
dissemination in sensor and mesh networks
* Algorithms and protocols to support quality of service in mesh and
sensor networks, including admission control, resource allocation and
fairness, and capacity planning
* Integration of sensors into engineered systems, including novel
techniques for on-sensor renewable power sources, mechanisms for
on-sensor self-calibration and self-testing, and efficient schemes to
maximize accuracy and minimize false alarms
* Hardware platforms incorporating multiple sensors, computation,
actuation, and wireless interfaces
* Software platforms, middleware, and tools for mesh and sensor
network applications development, deployment, and management
TUTORIALS AND PANELS:
Proposals for tutorials and panels on current topics in the field of
ad hoc and sensor networking and applications are solicited. Panels
related to the commercial application and development of sensors and
mesh networks are especially encouraged.
DEMOS AND EXPO:
Demonstrations that showcase practical implementations, industrial and
commercial developments, and new applications for mesh and sensor
networks are solicited.
SUBMISSION INSTRUCTIONS:
All paper submissions will be handled electronically through the EDAS
system. Details regarding the paper format and the submission process
are available at http://www.ieee-secon.org/2006/index.html.
Accepted papers will be published in the conference proceedings and
will appear on IEEE Xplore. IEEE Communications Society policy states
that all accepted SECON 2006 papers must have at least one
registration at the regular rate. For authors co-authoring multiple
papers, one regular registration is valid for up to three papers.
IMPORTANT DATES:
Paper registration: April 1, 2006, by 5pm EDT
Full Paper Submission: April 7, 2006, by 5pm EDT
Decision Notification: June 15, 2006, by 5pm EDT
Camera-ready paper due: July 7, 2006, by 5pm EDT
Tutorial/Panel proposals due: May 1, 2006, by 5pm EDT
Demo proposals due: June 1, 2006, by 5pm EDT
Poster proposals due: June 30, 2006, by 5pm EDT
CONFERENCE ORGANIZING COMMITEE
GENERAL CHAIR:
Krishna Sivalingam, University of Maryland Baltimore County,
krishna at umbc.edu
TECHNICAL PROGRAM CO-CHAIRS:
Mark Yarvis, Intel Corporation, mark.d.yarvis at intel.com
Michele Zorzi, Universita' degli Studi di Padova, zorzi at dei.unipd.it
POSTERS/DEMOS CO-CHAIRS:
Stefano Basagni, Northeastern University, basagni at ece.neu.edu
Cedric Westphal, Nokia, Cedric.Westphal at nokia.com
PANELS CO-CHAIRS:
Ian Chakeres, Boeing, ian.chakeres at gmail.com
Lily Yang, Intel, lily.l.yang at intel.com
TUTORIALS CHAIR:
Tom Hou, Virginia Tech, thou at vt.edu
PUBLICITY CHAIR:
Wendi Heinzelman, University of Rochester, wheinzel at ece.rochester.edu
EXHIBITS/SPONSORSHIPS CHAIR:
Vishal Anand, SUNY Brockport, vanand at brockport.edu
LOCAL ARRANGEMENTS CHAIR:
Mohamed Eltoweissy, Virgina Tech, toweissy at vt.edu
STANDING COMMITTEE:
Fred Bauer (fred at fredbauer.com), PacketHop (CHAIR)
Harvey Freeman, Booz Allen Hamilton
Sung-Ju Lee, HP Labs
Prasant Mohapatra, University of California, Davis
TECHNICAL PROGRAM COMMITTEE
Abouzeid, Alhussein Rensselaer Polytechnic Institute
Almeroth, Kevin University of California at Santa Barbara
Banerjee, Sujata HP Labs
Banerjee, Suman University of Wisconsin
Basagni, Stefano Northeastern University
Belding-Royer, Elizabeth University of California Santa Barbara
Bianchi, Giuseppe University of Rome, Tor Vergata
Boutaba, Raouf University of Waterloo
Cao, Guohong Pennsylvania State University
Cayirci, Erdal Istanbul Technical University
Chandra, Surendar University of Notre Dame
Chevillat, Pierre IBM
Choi, Sunghyun Seoul National Unversity
Chuah, Chen-Nee University of California, Davis
Das, Sajal University of Texas at Arlington
Das, Samir SUNY at Stony Brook
ElBatt, Tamer HRL Laboratories
Ekici, Eylem Ohio State
Ephremides, Anthony University of Maryland at College Park
Garcia-Luna-Aceves, J.J. University of California at Santa Cruz
Giordano, Silvia SUPSI of Lugano
Hares, Susan NextHop
Havinga, Paul University of Twente
Helmy, Ahmed USC
Iyer, Sridhar Indian Institute of Technology
Jetcheva, Jorjeta Firetide, Inc.
Jha, Sanjay University of NSW
Joshi, Anupam UMBC
Kangude, Shantanu Texas Instruments
Kasera, Sneha University of Utah
Ko, Young-Bae Ajou University
Koodli, Rajeev Nokia Research Center
Krishnamachari, Bhaskar University of Southern California
Krishnamurthy, Lakshman Intel Corp
Langendoen, Koen Delft University of Technology
Lee, Sung-Ju HP Labs
Li, Li Bell Labs, Lucent Technologies
Martin, Richard Rutgers University
Mohapatra, Prasant University of California, Davis
Morabito, Giacomo University of Catania, Italy
Nandagopal, Thyaga Bell Labs, Lucent Technologies
Ning, Peng North Carolina State University
Pagani, Elena University of Milano
Papagiannaki, Konstantina Intel Research
Petrioli, Chiara University of Rome, la Sapienza
Popovski, Petar Aalborg University
Qiu, Lili University of Texas at Austin
Ramasubramanian, Srini Unviersity of Arizona
Ramasubramanian, Venugopalan Microsoft Research
Reisslein, Martin Arizona State University
Rhee, Sokwoo Millennial Net
Roemer, Kay ETH Zurich
Santi, Paolo CNR
Schurgers, Curt University of California, San Diego
Shorey, Rajeev General Motors Research, Bangalore
Singh, Harkirat Samsung
Singh, Suresh Portland State University
Srinivasan, Vikram NU of Singapore
Stankovic, John University of Virginia
Trappe, Wade Rutgers University
Tseng, Yu-Chee National Chiao-Tung University
Wang, Xudong Kiyon, Inc
Westphal, Cedric Nokia Research Center
Widmer, Joerg DoCoMo
Zhang, Junshan Arizona State University
Zhang, Qian Hong Kong Univ. of Science and Technology
Zheng, Haitao University of California, Santa Barbara
Znati, Taieb University of Pittsburgh
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