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Edward Beili’s Response 1. There's no need for a separate document describing MIB usage for bonded copper - GBOND-MIB document is a perfect place for such info. 2. We cannot use the bonding management from EFM-CU-MIB instead of GBOND-ETH-MIB - the EFM-CU-MIB uses different terms and refers to a subset of management objects, talks only about 2BASE-TL and 10-PASS-TS, does not support performance monitoring (if we decide to add them) etc. |